Industry News2023-04-27

High-end probe cards protect the quality of high-computing AI chips—Suzhou Nanofab Semiconductor Technology Seminar and New Product Launch was held in Beijing

Summary:With the widespread application of large AI models such as ChatGPT, the global demand for chip computing power will increase significantly, which will trigger the need for high-energy consumption and ...

With the widespread application of large AI models such as ChatGPT, the global demand for chip computing power will increase significantly, which will trigger the need for high-energy consumption and high-power chip testing. Requirements such as bandwidth, frequency and current are getting higher and higher, and traditional cantilever needles and Cobra needles can no longer meet the resulting testing requirements; at the same time, sealing technology has also given rise to the development of KGD and high-frequency testing, which together have pushed the field of AI chip testing forward. To the high-end probe card market.

In response to this market demand, Suzhou Nanofab Semiconductor, a subsidiary of Shanghai TwinSolution Technology, launched an emergency N90 MEMS Cobra probe. This probe covers most of the specifications, performance and features of the classic Cobra probe, and on this basis shortens the process flow, improves manufacturing accuracy, improves high parallelism of testing, greatly reduces testing costs, and effectively solves the problem of high-end chip current Large, power consumption, high frequency, large number of pins and other requirements, and provide high and low temperature test environment. This probe card product is also suitable for the large-scale manufacturing of emerging industry chips such as automotive chips and logistics chips, and provides advanced testing products and a good testing environment for mainstream chip products in China's AI chip industry such as GPU, FGPA, and ASIC.

The development of the AI chip testing industry will have a profound impact on the entire chip testing industry. In addition, the high-performance requirements of high-end chips in the packaging stage have also significantly increased equipment power consumption. Therefore, ensuring that the chip can continue to operate at safe current and temperature while transmitting high-speed signals has become a major challenge for the quality of future chip products. to this end. TwinSolution Technology has developed a second-generation high-speed coaxial test solution based on embedded insulators that can meet the needs of larger size, higher bandwidth, higher speed and higher flexibility, enabling the continuous optimization of the mass production reliability of colloidal coaxial structures. Reliability is further improved. The solution is now being submitted for research and development patents.

Suzhou Nanofab also has decades of experience in PCB/MLO/MLC/LTCC design, SI/PI simulation engineers, and is good at PCB In the field of LoadBoard, it includes semiconductor FT test boards, high-rise high-density PCB manufacturing boards, fully automatic SMT patch panels, high-speed MEMS probe cards and burn-in boards and other semiconductor test boards, providing customers with one-stop PCB services.

This seminar attracted the participation of many users of cutting-edge technology in the industry. Chairman Yin Lanyong once said in an interview that Nanofab's current efforts in probe technology may be just a small step in the vast world of probe technology, but it may be a big step in the development of China's probe industry. In the future, Suzhou Nanofab Semiconductor will gradually explore the European, American, Southeast Asian and global chip markets, strive for excellence in chip testing technology, and make unremitting efforts to bring China's semiconductor technology to the world.

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