● Varies 4-point crown design enable“scrub”, for less soldermigration

● Jamming prevention

● Automatic thermal control

● Lean design with cost performance, Semi-Molded burn in socket

● Quick turn round for small volume engineering validation

● Capable for large scale BGA array.

● BGA QFN QFP Application

● High temperature: 155

Key reliability test which include HTOL/LTOL, HAST,HTSL,THB, etc

● By using conductive material build socket body to provide a uniform grounding redistributionregardless of customer pin map assignment.

● Take full advantage of air as the dielectric media to get a better signal transmission efficiency.

● Pitch range from 0.4mm,0.5mm,0.65mm,0.8mm, 1.Omm,1.27mm……

● Up to 84GHz bandwidth,112Gbps PAM4 transmission speed

● Adjustable different impedance control for different signal, etc.

● Great EM shielding performance, from board to DUT

● A composite material can do better than any single alloy, measured value for single spring ~ 500 mΩ but when made as composite ~ 100mΩ

● High CCC up to 800mA

● Pitch down to 80um

● Large pin count up to 10000+

● Nearly invisible probe mark

● Best co-planarity

● Good temperature behavior(-40℃ to 125℃)

● Low contact force , no risk for the CUP

    padProbe head spacer design to extend test lifetime

● Simple design , easy exchange of needles and can be done onsite

● Replaceable test head

WLCSP (Wafer Level Chip Scale Packaging) is new developed technology different from traditional packaging process, which is to complete testing on wafer. Thus, smaller outlines and high density can be effectively achieved. lt enables high speed and stable data transferring. TwinSolution develops and provides perfect WLCSP test interface solutions.

● Pitch scalability to 80um.

● Best-in-class Planarity

● Multiple Space Transformation Options

● High Pin-Count & Multi-Site: >3000 Probes.

● Low-force probing for Low_K and CUP pad.

● High-Current Solution:>1.0A

● Temperature: up to 150 degrees Celsius

● Life span: more than 5000 hours / up to 5 lots

● High Layer Count (50+)

● High Aspect Ratio (36:1 +)

● Dual Lamination

● Mix Lamination

● Impedance Control (± 5%)

● Special construction using mixed laminates

● 12X19 to 24X30 inches panel

● Supported template include: V93K-9.5/12, V93K-DD, V5400, J750, Ultraflex, Ultraflex DD, etc.

● Automatic test machines include：93k、J750、UFlex、Chroma、Accotest、etc

● Number of layers: 50+

● Frequency: 10Ghz+

● Pad spacing: 200um

Serviceable range：

BGA/LGA Test Socket (Both Final test and R&D purpose)

Advantage:

High Data Speed performance

High Current Capacity performance

Cost Effective

Better Final Test Yield

● Automatic testing Automatic testing and installation.

    Mode A: Bin1/NG material distribution tray

    Mode B: Tray in & Tray Maping

● Presoaking. Can preheat the chip . (Optional configuration)

● QR code reading. (Optional configuration)

● Multi-tray design, suitable for long-term unmanned testing.

● The test head is replaceable and suitable for a variety of products.