● By using conductive material build socket body to provide a uniform grounding redistributionregardless of customer pin map assignment.

● Take full advantage of air as the dielectric media to get a better signal transmission efficiency.

● Pitch range from 0.4mm,0.5mm,0.65mm,0.8mm, 1.Omm,1.27mm……

● Up to 84GHz bandwidth,112Gbps PAM4 transmission speed

● Adjustable different impedance control for different signal, etc.

● Great EM shielding performance, from board to DUT

● ldeal solution for GPU,SerDes,LPDDR,PAM4,HDMI, PCIE and SAW applications

● Great thermal management

● Suitable for large BGA 75X75mm or plus

● lnsulation coating and composite

● Pin count 10000+