Wafer Test
Current Location: Home Page · Products · Wafer Test · Wire Probe Head
Wire Probe Head

● Good temperature behavior(-40℃ to 125℃)

● Low contact force , no risk for the CUP

    padProbe head spacer design to extend test lifetime

● Simple design , easy exchange of needles and can be done onsite

● Replaceable test head

RFQ
Core Advantages
Application
Get in Touch with Us
Contact Us
Application
Industry Insight
Contact Us

Pre-sales / General Contact:CSR@twinsolution.com

Tel:86-0512-67069909

After-Sales Service:FAE@twinsolution.com

Share & Follow:

Copyright © Shanghai TwinSolution Technology Co. All rights reserved Support:bomin

Copyright Privacy | Disclaimer | Sitemap