WLCSP (Wafer Level Chip Scale Packaging) is new developed technology different from traditional packaging process, which is to complete testing on wafer. Thus, smaller outlines and high density can be effectively achieved. lt enables high speed and stable data transferring. TwinSolution develops and provides perfect WLCSP test interface solutions.

● Broad range of spring pins options for targeted application, with pitch ranging 200 - 650 um

● Special designed ternary alloy tip for maximum lifetime

● Replaceable individual probes for easy maintenance

● 5G mm Wave band support

● SAW filter ultra-low inductance design

● Nano surface coating technology enable solder migration free for contact sensitive device.

● Patented Super-Hard coating film high wear resistance application